We are delighted we took part in IMAPs conference “Power in Packaging” at Granta Park, Cambridge on the 4th April 2019. Excellent event, packed with interesting presentations about current trends in power electronics packaging, with strong focus on electric and autonomous vehicles, and renewable energy generation. Dr Harry Cronin, R&D manager, presented our work on 3D printable electrical interconnects for power modules. We look forward to introducing our innovation in the next generations of electric vehicles!
- Spotlight on conductive materials
- DZP Technologies’ pioneering work published by the National Physical Laboratory (NPL)
- Power in Packaging with our 3D printed interconnects
- Photonic Curing of Low-Cost Aqueous Silver Flake Inks for Printed Conductors with Increased Yield, Applied Materials and Interfaces 10 (2018) 21398.
- HiPerNano 2018