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Power in Packaging with our 3D printed interconnects

Power in Packaging with our 3D printed interconnects

We are delighted we took part in IMAPs conference “Power in Packaging” at Granta Park, Cambridge on the 4th April 2019. Excellent event, packed with interesting presentations about current trends in power electronics packaging, with strong focus on electric and...

HiPerNano 2018

HiPerNano 2018 is taking place on the 27th June in London and our Managing Director Dr Zlatka Stoeva will be presenting about our latest work on graphene and other 2D materials for energy storage applications.    This year’s HiPerNano conference is entitled...
Our wearable technology sparkles at London ExCeL

Our wearable technology sparkles at London ExCeL

A big thank you to everyone who visited our stand at the Wearable Technology Show at the London ExCeL, 13-14 March 2018, the biggest event for wearables, artificial intelligence, Internet of Things, and connected technology. We were delighted to showcase our latest...